DDR5 Liquid Immersion RDIMM

In our information-driven age, powerful High Performance Computing (HPC) platforms are processing massive amounts of data in an effort to unlock its value. To yield the insights necessary to move humankind forward, HPC solutions constantly evolve. Optimizing the reliability of the memory sub-system for maximum uptime is critical to success.

Exposure to sulfur dioxide causes a corrosive reaction when silver alloys encounter sulfur gasses or liquid. This typically decreases resistor conductivity and thus increases failure risks. SMART uses ASRs (Anti-Sulfur Resistors) when needed for SMART-built products, allowing them to operate reliably in harsh sulfur-rich environments to meet the highest industrial standards.

As industrial devices have to survive exposure to harsh environments, conformal coating improves product ruggedness when applied on the module surface area. It enhances product reliability and safeguards against damage from dust, high humidity, salt water air, solvents, chemicals and other harsh materials.

Along with increasing amount of IT devices and systems installed in modern enterprises, more and more data is generated and transported everyday between physical equipment and virtual spaces, like the cloud. In order to efficiently and effectively store and manage these quantities of data, it’s becoming necessary to build a data infrastructure that can accommodate in-house data centers or that can be outsourced to cloud service providers. Whether the data infrastructure is internal or external, the main purpose is to gather process and store the data under stable and secure conditions to ensure uninterrupted operation for the enterprises.

Accelerated AI and ML workloads often require high bandwidth memory to keep up with the massive amounts of data being processed. There's a need for memory architectures that can deliver higher bandwidth to match the computational capabilities of modern accelerators. This could involve innovations in DRAM design, such as wider memory buses, faster memory interfaces, or the integration of high-bandwidth memory (HBM) technologies.

High Performance Computing (HPC) represents a leading solution being used to model and understand complex issues such as weather, agriculture, and space. HPC applications require the ability to process data and perform complex calculations at high speeds in limited timeframes. For applications such as AI machine/deep learning, data analysis, or medical research, HPC can process massive amount of data in real time. As HPC increases, so will the demands for high performing and reliable memory to deliver on expectations.