AI & HPC Data Centers
Fault Tolerant Solutions
Integrated Memory

Showing X Brochures

Built on decades of engineering expertise at the intersection of memory and AI/HPC infrastructure, we bring together differentiated infrastructure software, advanced memory, compute systems, end-to-end services, and industry-leading partner solutions.

Built on decades of engineering expertise at the intersection of memory and AI/HPC infrastructure, we bring together differentiated infrastructure software, advanced memory, compute systems, end-to-end services, and industry-leading partner solutions.

Standard commercial memory often fails to deliver the resilience, endurance, and operational longevity required for mission-critical automotive features and real-time processing essential to safety and convenience.

Standard commercial memory often fails to deliver the resilience, endurance, and operational longevity required for mission-critical automotive features and real-time processing essential to safety and convenience.

Reliable operation under rugged shock and vibration conditions and protection from harsh environmental factors such as moisture, sulfur, and salt.

Reliable operation under rugged shock and vibration conditions and protection from harsh environmental factors such as moisture, sulfur, and salt.

Wide portfolio of memory products including form factors, technologies, speeds, and densities that are ideally suited for networking and telecom.

Wide portfolio of memory products including form factors, technologies, speeds, and densities that are ideally suited for networking and telecom.

Zefr Memory is processed to real-world conditions to eliminate over 90% of remaining memory reliability failures, lowering DPPM to under 200.

Zefr Memory is processed to real-world conditions to eliminate over 90% of remaining memory reliability failures, lowering DPPM to under 200.

Modern enterprises increasingly rely on hyperscale networking infrastructure to connect vast numbers of servers and deliver carrier-grade throughput and bandwidth.

Modern enterprises increasingly rely on hyperscale networking infrastructure to connect vast numbers of servers and deliver carrier-grade throughput and bandwidth.

The rapid expansion of Industrial Internet of Things (IIoT) deployments is driving exponential growth in endpoint data creation, placing unprecedented demands on memory solutions.

The rapid expansion of Industrial Internet of Things (IIoT) deployments is driving exponential growth in endpoint data creation, placing unprecedented demands on memory solutions.

SMART Modular’s DRAM memory modules are available in various form factors that include standard height and special DIMM types, including Very Low Profile (VLP), Ultra Low Profile (ULP), mini-DIMM, Module-in-a-Package (MIP), LRDIMM, XRDIMM and NVDIMM.

SMART Modular’s DRAM memory modules are available in various form factors that include standard height and special DIMM types, including Very Low Profile (VLP), Ultra Low Profile (ULP), mini-DIMM, Module-in-a-Package (MIP), LRDIMM, XRDIMM and NVDIMM.

Edge computing environments generate and process vast amounts of data locally, demanding memory solutions that can handle high data density and real-time processing without frequent offloading to the cloud.

Edge computing environments generate and process vast amounts of data locally, demanding memory solutions that can handle high data density and real-time processing without frequent offloading to the cloud.

As workloads become increasingly complex and mission-critical, even brief memory failures can result in costly downtime, data loss, or operational delays.

As workloads become increasingly complex and mission-critical, even brief memory failures can result in costly downtime, data loss, or operational delays.

Traditional memory configurations often lead to bottlenecks, limiting server capacity and causing stranded memory.

Traditional memory configurations often lead to bottlenecks, limiting server capacity and causing stranded memory.

In defense and industrial applications, electronic systems often face severe environmental challenges, including extreme temperatures, moisture, and exposure to harmful substances.

In defense and industrial applications, electronic systems often face severe environmental challenges, including extreme temperatures, moisture, and exposure to harmful substances.

SMART’s Zefr Memory undergoes a proprietary screening process to deliver ultra-high reliability for demanding workloads.

SMART’s Zefr Memory undergoes a proprietary screening process to deliver ultra-high reliability for demanding workloads.

Highly ruggedized memory modules for mission-critical environments.

Highly ruggedized memory modules for mission-critical environments.

Fast data access and high density for storage applications with large memory databases.

Fast data access and high density for storage applications with large memory databases.

Using highly reliable DRAM memory for AI and ML applications is extremely critical. If there are too many memory ECC errors or other catastrophic DRAM bit failure issues this will cause a system shutdown and the entire training job needs to be restarted.

Using highly reliable DRAM memory for AI and ML applications is extremely critical. If there are too many memory ECC errors or other catastrophic DRAM bit failure issues this will cause a system shutdown and the entire training job needs to be restarted.

Memory solutions are transforming the landscape of fintech and high-frequency trading by addressing critical challenges in financial data processing.

Memory solutions are transforming the landscape of fintech and high-frequency trading by addressing critical challenges in financial data processing.

VLP and ULP memory modules help maximize system density and performance with vertical placement of DIMM sockets in blade applications to save space.

VLP and ULP memory modules help maximize system density and performance with vertical placement of DIMM sockets in blade applications to save space.

SMART collaborates closely with their global OEM customers throughout their design process and across multiple projects to create reliable and efficient solutions for demanding applications with differentiated requirements.

SMART collaborates closely with their global OEM customers throughout their design process and across multiple projects to create reliable and efficient solutions for demanding applications with differentiated requirements.

Real time AI presents some significant challenges for the financial world, where data has to be highly accurate, up to date and responses are needed “instantly” in order to make more informed decisions at most levels.

Real time AI presents some significant challenges for the financial world, where data has to be highly accurate, up to date and responses are needed “instantly” in order to make more informed decisions at most levels.

Deliver serial memory expansion solutions via CXL at the forefront of data center technology.

Deliver serial memory expansion solutions via CXL at the forefront of data center technology.