DDR5 VLP ECC CUDIMM

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Product Brief

SMART Modular Technologies offers high-performance DDR5 ECC VLP CUDIMM modules designed for space constrained systems that demand reliable operation and high memory bandwidth. With a very low profile height of 18.75mm, these modules enable vertical placement in 1U blades and dense boards while maintaining adequate airflow and serviceability.

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DDR5 VLP ECC CUDIMM
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DDR5 VLP ECC CUDIMM
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Ordering Information

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Part Number

Capacity

Note

SR4G7CD528JHCV
32GB
C-Temp (0˚C to +70˚C)
SR4G7CD528JSQV
48GB
C-Temp (0˚C to +70˚C)
SR6G7CD538JHMV
48GB
C-Temp (0˚C to +70˚C)
SR8G7CD548JSMV
64GB
C-Temp (0˚C to +70˚C)

Product Details

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Essentials

Technology
DDR5
Module Type
VLP ECC CUDIMM
Temperature
C-temp: 0˚C to +70˚C
Component Configuration
2Gx8
Depth
4G, 6G, 8G
Width
x72
Voltage
1.1V
Pin Count
288-Pin

Performance

Capacity
32GB, 48GB, 64GB
Data Rate
6400 MT/s
Speed
PC5-4480
CL
CL=40 CL=46

Environmental

RoHS
Yes

Physical

Height
18.75mm

Technologies

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Solutions

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With the rapid rise of IoT and IIoT, the demand for connectivity has transformed networking. Today’s networks are scaling at an exponential rate, processing huge amounts of data that are stored for analysis. Reliable, proven memory is vital to ensure the hyper-fast transmission of all that data, as well as storage of the data exchanged between edge devices and network hubs. Whether the scale of network is between two locations or built for thousands of connected devices in different places around the world, there will be huge amounts of data constantly being processed whenever the network is running. That is why the right memory solutions are so important – to ensure data will be processed quickly and stored securely regardless of the demand placed on the network.

From small industrial components deployed in automation systems to large equipment used for oil drilling, project operations are asked to provide precise instructions, occasionally in harsh environments. Therefore, it is critical to maintain the accuracy of data output in addition to maintaining continuous, stable operating performance.

Accelerated AI and ML workloads often require high bandwidth memory to keep up with the massive amounts of data being processed. There's a need for memory architectures that can deliver higher bandwidth to match the computational capabilities of modern accelerators. This could involve innovations in DRAM design, such as wider memory buses, faster memory interfaces, or the integration of high-bandwidth memory (HBM) technologies.

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