AI & HPC Data Centers
Fault Tolerant Solutions
Integrated Memory
SMART's ULP ECC UDIMMs (Ultra Low Profile) are used in space-constrained telecom, networking, and computing 'blade' applications, which have one or two DIMM sockets per CPU. Blade systems have a 1U height or less. ULP ECC UDIMMs can be used vertically in these applications to maximize system density. They have error correction code built in, which detects and corrects common kinds of internal data corruption.
Specifically designed for harsh environments, SMART’s industrial-grade products with industrial wide-temp ICs and components ensure the highest reliability and stability in extreme operating environments.
From small industrial components deployed in automation systems to large equipment used for oil drilling, project operations are asked to provide precise instructions, occasionally in harsh environments. Therefore, it is critical to maintain the accuracy of data output in addition to maintaining continuous, stable operating performance.
With the rapid rise of IoT and IIoT, the demand for connectivity has transformed networking. Today’s networks are scaling at an exponential rate, processing huge amounts of data that are stored for analysis. Reliable, proven memory is vital to ensure the hyper-fast transmission of all that data, as well as storage of the data exchanged between edge devices and network hubs. Whether the scale of network is between two locations or built for thousands of connected devices in different places around the world, there will be huge amounts of data constantly being processed whenever the network is running. That is why the right memory solutions are so important – to ensure data will be processed quickly and stored securely regardless of the demand placed on the network.
Reach out today and discover our level of technical expertise and customer support which continues to be an industry differentiator among memory manufacturers.