AI 和 HPC 数据中心
容错解决方案
集成内存
The comprehensive Zefr™ memory screening process simulates the most strenuous real-world conditions combining temperature, speed, load, system, and time. Over 4 million memory modules shipped with proven long-term reliability and performance.
Zefr high reliability memory is an innovative solution designed to address the critical need for uninterrupted operation in data-intensive computing environments. This proprietary technology employs a unique screening process that eliminates over 90% of memory reliability failures, optimizing memory subsystems for maximum uptime.
By identifying and filtering out marginal components that may compromise memory reliability, Zefr memory significantly reduces system start-up delays and errors that can lead to inefficiencies, higher maintenance costs, and lower system yield rates. This advanced memory solution has been rigorously tested under real-world conditions to ensure the industry’s highest levels of uptime and reliability.
Zefr memory is specifically engineered to meet the demanding requirements of data centers, hyperscalers, high-performance computing (HPC) platforms, and other environments that run large memory applications and depend on continuous operation.
A carefully calibrated burn-in process strikes a critical balance between rigorous testing and real-world performance. This process is based on extensive field test data and modeling, ensuring that modules are stressed to their maximum thresholds while still reflecting normal operating conditions over their service life. The burn-in duration is meticulously determined to confidently identify all potential flaws, significantly reducing deployment issues.
By integrating SMART Modular’s Zefr memory, system designers and end users can expect enhanced computing performance and a significant boost in overall system reliability.
Zefr memory is particularly valuable for applications that require extended periods of uninterrupted computation, such as artificial intelligence (AI), machine learning (ML), simulations and in-memory databases. It enables complex algorithms and data-intensive processes to run to completion without interruptions or time-consuming restarts, thereby preserving valuable resources and maintaining operational efficiency.
Test scripts and programs randomly exercise the entire memory array with over 98% coverage and 35% higher power draw than standard memory test programs. Memory modules that record even a single error code correction (ECC) occurrence are disqualified from Zefr classification.
Tests on actual Intel or AMD motherboards ensure that only dual in-line memory modules (DIMMs) that perform in true, real world systems get selected.
Tests at high speeds ensure that only DIMMs with robust timing margins get selected.
DIMMs with devices susceptible to infant mortality due to a variety of failure mechanisms such as metal migration get screened as they get tested at ~70°C ambient temperature. Running the systems at this temperature with 100% DRAM utilization pushes the DRAM case temperature to +85°C.
Seven-to-ten-hour test durations ensure that the DIMMs are capable of performing reliably for applications that run continuously for longer periods of time.
Enabling real-time algorithm processing for large-scale data model analysis and inference.
Facilitating high-volume business operations automation and data processing in real-time.
Supporting complex modeling for financial markets, government functions, and trend analysis.
Enhancing performance and reliability for Big Data and data-intensive applications.
Reach out today and discover our level of technical expertise and customer support which continues to be an industry differentiator among memory manufacturers.